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      High thermal conductivity in amorphous polymer blends by engineered interchain interactions

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          Abstract

          Thermal conductivity is an important property for polymers, as it often affects product reliability (for example, electronics packaging), functionality (for example, thermal interface materials) and/or manufacturing cost. However, polymer thermal conductivities primarily fall within a relatively narrow range (0.1-0.5 W m(-1) K(-1)) and are largely unexplored. Here, we show that a blend of two polymers with high miscibility and appropriately chosen linker structure can yield a dense and homogeneously distributed thermal network. A sharp increase in cross-plane thermal conductivity is observed under these conditions, reaching over 1.5 W m(-1) K(-1) in typical spin-cast polymer blend films of nanoscale thickness, which is approximately an order of magnitude larger than that of other amorphous polymers.

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          Most cited references29

          • Record: found
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          The Hydrogen Bond in the Solid State

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            Ultrastrong and stiff layered polymer nanocomposites.

            Nanoscale building blocks are individually exceptionally strong because they are close to ideal, defect-free materials. It is, however, difficult to retain the ideal properties in macroscale composites. Bottom-up assembly of a clay/polymer nanocomposite allowed for the preparation of a homogeneous, optically transparent material with planar orientation of the alumosilicate nanosheets. The stiffness and tensile strength of these multilayer composites are one order of magnitude greater than those of analogous nanocomposites at a processing temperature that is much lower than those of ceramic or polymer materials with similar characteristics. A high level of ordering of the nanoscale building blocks, combined with dense covalent and hydrogen bonding and stiffening of the polymer chains, leads to highly effective load transfer between nanosheets and the polymer.
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              Broadband phonon mean free path contributions to thermal conductivity measured using frequency domain thermoreflectance.

              Non-metallic crystalline materials conduct heat by the transport of quantized atomic lattice vibrations called phonons. Thermal conductivity depends on how far phonons travel between scattering events-their mean free paths. Due to the breadth of the phonon mean free path spectrum, nanostructuring materials can reduce thermal conductivity from bulk by scattering long mean free path phonons, whereas short mean free path phonons are unaffected. Here we use a breakdown in diffusive phonon transport generated by high-frequency surface temperature modulation to identify the mean free path-dependent contributions of phonons to thermal conductivity in crystalline and amorphous silicon. Our measurements probe a broad range of mean free paths in crystalline silicon spanning 0.3-8.0 μm at a temperature of 311 K and show that 40±5% of its thermal conductivity comes from phonons with mean free path >1 μm. In a 500 nm thick amorphous silicon film, despite atomic disorder, we identify propagating phonon-like modes that contribute >35±7% to thermal conductivity at a temperature of 306 K.
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                Author and article information

                Journal
                Nature Materials
                Nature Mater
                Springer Science and Business Media LLC
                1476-1122
                1476-4660
                March 2015
                November 24 2014
                March 2015
                : 14
                : 3
                : 295-300
                Article
                10.1038/nmat4141
                0e659320-a78e-4b50-9c02-e483e1112a3f
                © 2015

                http://www.springer.com/tdm

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