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      Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper

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          Abstract

          Epoxy resin-impregnated insulation paper (RIP) composites are used as the inner insulation of dry condenser bushing in the ultra-high voltage direct current (UHVDC) power transmission system. To improve the dielectric properties and heat conductivity of RIP, hexagonal boron nitride (h-BN) nano-flakes are added to the insulation paper at concentrations of 0–50 wt % before impregnation with pure epoxy resin. X-ray diffraction (XRD), scanning electron microscopy (SEM) observations, thermal conductivity as well as the typical dielectric properties of direct current (DC) volume conductivity. DC breakdown strength and space charge characteristics were obtained. The maximum of nano-h-BN modified heat conductivity reach 0.478 W/(m·K), increased by 139% compared with unmodified RIP. The DC breakdown electric field strength of the nano-h-BN modified RIP does not reduce much. The conductivity of nano-h-BN modified is less sensitive to temperature. As well, the space charge is suppressed when the content is 50 wt %. Therefore, the nano-h-BN modified RIP is potentially useful in practical dry DC bushing application.

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          Understanding the conduction and breakdown properties of polyethylene nanodielectrics: effect of deep traps

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            Epoxy thermoset resins with high pristine thermal conductivity

            Heat dissipation becomes a critical problem because of the miniaturisation and the increase of power density in electronic devices and electric equipment, which calls for electrical insulating materials with high thermal management capability. Epoxy thermosets have been widely used as electrical insulating materials, but suffer from their low thermal conductivity. This study reviewed the research progress on the development of epoxy thermosets with high pristine thermal conductivity. First, the thermal conduction mechanism of polymers was briefly introduced. Second, the approaches used to enhance the thermal conductivity of epoxy thermosets were summarised, which mainly dealt with the formation of microscopically anisotropic but macroscopically isotropic structure in the epoxy thermosets. Third, the applications of high thermal conductivity epoxy thermoset resins were reviewed. Finally, the review provided the existing challenges and the future directions for the development of epoxy thermosets with high pristine thermal conductivity.
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              Achieving High Thermal Conductivity in Epoxy Composites: Effect of Boron Nitride Particle Size and Matrix-Filler Interface

              For the thermal management of high watt density circuit layers, it is common to use a filled epoxy system to provide an electrically insulating but thermally conducting bond to a metal substrate. An epoxy-thiol system filled with boron nitride (BN), in the form of 2, 30 and 180 µm platelets, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry and the thermal conductivity of the cured samples has been measured by the Transient Hot Bridge method. The heat of reaction and the glass transition temperature of the fully cured samples are both independent of the BN content, but the cure reaction kinetics is systematically affected by both BN content and particle size. These results can be correlated with the thermal conductivity of the cured systems, which is found to increase with both BN content and particle size. For a given BN content, the thermal conductivity found here is significantly higher than most others reported in the literature; this effect is attributed to a Lewis acid-base interaction between filler and matrix.
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                Author and article information

                Journal
                Polymers (Basel)
                Polymers (Basel)
                polymers
                Polymers
                MDPI
                2073-4360
                16 August 2019
                August 2019
                : 11
                : 8
                : 1359
                Affiliations
                [1 ]Heilongjiang Provincial Key Laboratory of Dielectric Engineering, School of Electrical and Electronic Engineering, Harbin University of Science and Technology, Harbin 150080, China
                [2 ]Key Laboratory of Engineering Dielectrics and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150080, China
                [3 ]State Grid Heilongjiang Electric Power Company Limited Electric Power Research Institute, Harbin 150030, China
                Author notes
                [* ]Correspondence: qgchen_hrbust@ 123456126.com (Q.C.); wxy@ 123456hrbust.edu.cn (X.W.); Tel.: +86-0541-8639-1627 (Q.C.); +86-0541-8639-1628 (X.W.)
                Author information
                https://orcid.org/0000-0001-6296-4428
                Article
                polymers-11-01359
                10.3390/polym11081359
                6723158
                31426395
                0d8b5201-4115-4dff-935a-387a9951edcc
                © 2019 by the authors.

                Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license ( http://creativecommons.org/licenses/by/4.0/).

                History
                : 10 July 2019
                : 14 August 2019
                Categories
                Article

                dry bushing,epoxy resin-impregnated paper,dielectric characteristics,thermal conductivity,space charge,nanocomposite

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