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      Micromachined Jets for Liquid Impingement Cooling of VLSI Chips

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          High-performance heat sinking for VLSI

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            High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks

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              Porous glass electroosmotic pumps: design and experiments.

              An analytical model for electroosmotic flow rate, total pump current, and thermodynamic efficiency reported in a previous paper has been applied as a design guideline to fabricate porous-structure EO pumps. We have fabricated sintered-glass EO pumps that provide maximum flow rates and pressure capacities of 33 ml/min and 1.3 atm, respectively, at applied potential 100 V. These pumps are designed to be integrated with two-phase microchannel heat exchangers with load capacities of order 100 W and greater. Experiments were conducted with pumps of various geometries and using a relevant, practical range of working electrolyte ionic concentration. Characterization of the pumping performance are discussed in the terms of porosity, tortuosity, pore size, and the dependence of zeta potential on bulk ion density of the working solution. The effects of pressure and flow rate on pump current and thermodynamic efficiency are analyzed and compared to the model prediction. In particular, we explore the important tradeoff between increasing flow rate capacity and obtaining adequate thermodynamic efficiency. This research aims to demonstrate the performance of EOF pump systems and to investigate optimal and practical pump designs. We also present a gas recombination device that makes possible the implementation of this pumping technology into a closed-flow loop where electrolytic gases are converted into water and reclaimed by the system.
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                Author and article information

                Journal
                Journal of Microelectromechanical Systems
                J. Microelectromech. Syst.
                Institute of Electrical and Electronics Engineers (IEEE)
                1057-7157
                October 2004
                October 2004
                : 13
                : 5
                : 833-842
                Article
                10.1109/JMEMS.2004.835768
                © 2004
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