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      On the effect of power cycling stress on IGBT modules

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      Microelectronics Reliability
      Elsevier BV

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          Journal
          Microelectronics Reliability
          Microelectronics Reliability
          Elsevier BV
          00262714
          June 1998
          June 1998
          : 38
          : 6-8
          : 1347-1352
          Article
          10.1016/S0026-2714(98)00081-X
          1c40b114-bbde-4c32-8428-dbd86347d876
          © 1998

          http://www.elsevier.com/tdm/userlicense/1.0/

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