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      Superconformal Electrodeposition in Submicron Features

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          Damascene copper electroplating for chip interconnections

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            Superconformal Electrodeposition of Copper in 500–90 nm Features

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              Theory of Filling of High-Aspect Ratio Trenches and Vias in Presence of Additives

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                Author and article information

                Journal
                PRLTAO
                Physical Review Letters
                Phys. Rev. Lett.
                American Physical Society (APS)
                0031-9007
                1079-7114
                June 2001
                June 15 2001
                : 87
                : 1
                Article
                10.1103/PhysRevLett.87.016102
                1e625bfd-e1e3-4886-b0ca-1b7a4fc90a94
                © 2001

                http://link.aps.org/licenses/aps-default-license

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