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Investigation of moisture-induced delamination failure in a semiconductor package via multi-scale mechanics
Author(s):
Hak-Sung Kim
,
Jeehyang Huh
,
Jongeun Ryu
Publication date:
2011
Journal:
Journal of Physics D: Applied Physics
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International Conference on Moisture in Buildings Series
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Journal
DOI::
10.1088/0022-3727/44/3/034007
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