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      Study of low-temperature direct bonding of (111) and (100) silicon wafers under various ambient and surface conditions

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      Sensors and Actuators A: Physical
      Elsevier BV

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          Journal
          Sensors and Actuators A: Physical
          Sensors and Actuators A: Physical
          Elsevier BV
          09244247
          March 2000
          March 2000
          : 80
          : 1
          : 68-76
          Article
          10.1016/S0924-4247(99)00299-X
          2a434cc8-764b-4084-8c4f-1305e39dee57
          © 2000

          http://www.elsevier.com/tdm/userlicense/1.0/

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