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Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films
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Most cited references7
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- Abstract: not found
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Electromigration Damage in Aluminum Film Conductors
M. Attardo, R. Rosenberg (1970)
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Electromigration and failure in electronics: An introduction
F.M. D'Heurle (1971)
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Linewidth dependence of electromigration in evaporated Al‐0.5%Cu
S. Vaidya, T. T. Sheng, A. K. Sinha (1980)