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Thermal, mechanical and electrical properties of copper powder filled low-density and linear low-density polyethylene composites
Author(s):
A.S. Luyt
,
J.A. Molefi
,
H. Krump
Publication date
Created:
July 2006
Publication date
(Print):
July 2006
Journal:
Polymer Degradation and Stability
Publisher:
Elsevier BV
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26
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Thermal conductivity, thermal diffusivity, and specific heat capacity of particle filled polypropylene
Frank R. Schilling
,
Bernd Weidenfeller
,
Michael Hofer
(2004)
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Thermal conductivities of composites in several types of dispersion systems
A Ueda
,
S Nagai
,
Y. Agari
(1991)
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Physical properties of thermoplastic/graphite composites
I Chodák
,
I Krupa
(2001)
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Author and article information
Journal
Title:
Polymer Degradation and Stability
Abbreviated Title:
Polymer Degradation and Stability
Publisher:
Elsevier BV
ISSN (Print):
01413910
Publication date Created:
July 2006
Publication date (Print):
July 2006
Volume
: 91
Issue
: 7
Pages
: 1629-1636
Article
DOI:
10.1016/j.polymdegradstab.2005.09.014
SO-VID:
2f747722-3d08-44ba-823b-8235b2ded15a
Copyright ©
© 2006
License:
http://www.elsevier.com/tdm/userlicense/1.0/
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