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      Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints

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      Journal of Electronic Packaging
      ASME International

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          Author and article information

          Journal
          JEPAE4
          Journal of Electronic Packaging
          J. Electron. Packag.
          ASME International
          10437398
          1994
          1994
          : 116
          : 4
          : 290
          Article
          10.1115/1.2905700
          340b83f2-75da-4d35-90a4-6d8023494e9a
          © 1994
          History

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