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      Characterization of Via Etching in CHF3/CF4Magnetically Enhanced Reactive Ion Etching Using Neural Networks

      , , , , , ,
      ETRI Journal
      Wiley

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          Spectroscopic diagnostics of CF4‐O2 plasmas during Si and SiO2 etching processes

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            Advantages of plasma etch modeling using neural networks over statistical techniques

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              Reaction of fluorine atoms with SiO2

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                Author and article information

                Journal
                ETRI Journal
                ETRI J
                Wiley
                1225-6463
                June 01 2002
                June 01 2002
                : 24
                : 3
                : 211-220
                Article
                10.4218/etrij.02.0102.0305
                36301bcb-d4da-4abf-967d-95144b2871fc
                © 2002
                History

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