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      Assessment of high-heat-flux thermal management schemes

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          High-performance heat sinking for VLSI

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            High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks

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              Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints

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                Author and article information

                Journal
                IEEE Transactions on Components and Packaging Technologies
                IEEE Trans. Comp. Packag. Technol.
                Institute of Electrical and Electronics Engineers (IEEE)
                15213331
                June 2001
                : 24
                : 2
                : 122-141
                Article
                10.1109/6144.926375
                383dc713-f2ad-439c-93a2-48d74c5f4319
                History

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