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      Dislocation-free Ge Nano-crystals via Pattern Independent Selective Ge Heteroepitaxy on Si Nano-Tip Wafers

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          Abstract

          The integration of dislocation-free Ge nano-islands was realized via selective molecular beam epitaxy on Si nano-tip patterned substrates. The Si-tip wafers feature a rectangular array of nanometer sized Si tips with (001) facet exposed among a SiO 2 matrix. These wafers were fabricated by complementary metal-oxide-semiconductor (CMOS) compatible nanotechnology. Calculations based on nucleation theory predict that the selective growth occurs close to thermodynamic equilibrium, where condensation of Ge adatoms on SiO 2 is disfavored due to the extremely short re-evaporation time and diffusion length. The growth selectivity is ensured by the desorption-limited growth regime leading to the observed pattern independence, i.e. the absence of loading effect commonly encountered in chemical vapor deposition. The growth condition of high temperature and low deposition rate is responsible for the observed high crystalline quality of the Ge islands which is also associated with negligible Si-Ge intermixing owing to geometric hindrance by the Si nano-tip approach. Single island as well as area-averaged characterization methods demonstrate that Ge islands are dislocation-free and heteroepitaxial strain is fully relaxed. Such well-ordered high quality Ge islands present a step towards the achievement of materials suitable for optical applications.

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          Dislocation-free Stranski-Krastanow growth of Ge on Si(100).

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            Tunnel field-effect transistors as energy-efficient electronic switches.

            Power dissipation is a fundamental problem for nanoelectronic circuits. Scaling the supply voltage reduces the energy needed for switching, but the field-effect transistors (FETs) in today's integrated circuits require at least 60 mV of gate voltage to increase the current by one order of magnitude at room temperature. Tunnel FETs avoid this limit by using quantum-mechanical band-to-band tunnelling, rather than thermal injection, to inject charge carriers into the device channel. Tunnel FETs based on ultrathin semiconducting films or nanowires could achieve a 100-fold power reduction over complementary metal-oxide-semiconductor (CMOS) transistors, so integrating tunnel FETs with CMOS technology could improve low-power integrated circuits. © 2011 Macmillan Publishers Limited. All rights reserved
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              Ge-Photodetectors for Si-Based Optoelectronic Integration

              High speed photodetectors are a key building block, which allow a large wavelength range of detection from 850 nm to telecommunication standards at optical fiber band passes of 1.3–1.55 μm. Such devices are key components in several applications such as local area networks, board to board, chip to chip and intrachip interconnects. Recent technological achievements in growth of high quality SiGe/Ge films on Si wafers have opened up the possibility of low cost Ge-based photodetectors for near infrared communication bands and high resolution spectral imaging with high quantum efficiencies. In this review article, the recent progress in the development and integration of Ge-photodetectors on Si-based photonics will be comprehensively reviewed, along with remaining technological issues to be overcome and future research trends.
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                Author and article information

                Journal
                Sci Rep
                Sci Rep
                Scientific Reports
                Nature Publishing Group
                2045-2322
                04 March 2016
                2016
                : 6
                : 22709
                Affiliations
                [1 ]IHP, Im Technologiepark 25 , 15236 Frankfurt (Oder), Germany
                [2 ]Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, Xi’an Jiaotong University , Xi’an 710049, China
                [3 ]Dipartimento di Scienze, Università Roma Tre , Viale Marconi 446, 00146 Rome, Italy
                [4 ]Technische Universität Berlin, Institut für Optik und Atomare Physik , Straße des 17. Juni 135, 10623 Berlin, Germany
                [5 ]University of California at Los Angeles, Department of Materials Science and Engineering , Los Angeles, CA 90095-1595, United States
                [6 ]ETH Zürich, Labor für Festkörperphysik , Otto-Stern-Weg, 18093 Zürich, Switzerland
                [7 ]BTU Cottbus-Senftenberg , Konrad-Zuse-Straße 1, 03046 Cottbus, Germany
                Author notes
                Article
                srep22709
                10.1038/srep22709
                4778127
                26940260
                3a0ea6ab-8241-42e9-bd7f-01f942cfa2d2
                Copyright © 2016, Macmillan Publishers Limited

                This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/

                History
                : 21 January 2016
                : 18 February 2016
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