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Dynamic precipitation processes of Al2Cu in Al‐Cu thin films byin situtransmission electron microscopy
Author(s):
M. Park
,
S. J. Krause
,
S. R. Wilson
Publication date
Created:
February 07 1994
Publication date
(Print):
February 07 1994
Journal:
Applied Physics Letters
Publisher:
AIP Publishing
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Atomic Force Microscopy
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The evolution of microstructure in Al-2 Pct Cu thin films: Precipitation, dissolution, and reprecipitation
J. Sánchez
,
A. D. Romig
,
J W Morris
…
(1990)
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Electromigration in fine‐line sputter‐gun Al
W. Lindenberger
,
S. Vaidya
,
D B Fraser
(1980)
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Formation of second phase particles in aluminum-copper alloy films
S. Mader
,
S Herd
(1972)
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Author and article information
Journal
Title:
Applied Physics Letters
Abbreviated Title:
Appl. Phys. Lett.
Publisher:
AIP Publishing
ISSN (Print):
0003-6951
ISSN (Electronic):
1077-3118
Publication date Created:
February 07 1994
Publication date (Print):
February 07 1994
Volume
: 64
Issue
: 6
Pages
: 721-723
Article
DOI:
10.1063/1.111046
SO-VID:
3aef6e0a-e144-4101-bcad-f500c4c3c17b
Copyright ©
© 1994
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