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Dynamic precipitation processes of Al2Cu in Al‐Cu thin films byin situtransmission electron microscopy

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Applied Physics Letters

AIP Publishing

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      The evolution of microstructure in Al-2 Pct Cu thin films: Precipitation, dissolution, and reprecipitation

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        Electromigration in fine‐line sputter‐gun Al

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          Formation of second phase particles in aluminum-copper alloy films

           S. Mader,  S Herd (1972)
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            Author and article information

            Journal
            Applied Physics Letters
            Appl. Phys. Lett.
            AIP Publishing
            0003-6951
            1077-3118
            February 07 1994
            February 07 1994
            : 64
            : 6
            : 721-723
            10.1063/1.111046
            © 1994
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