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      Dynamic precipitation processes of Al2Cu in Al‐Cu thin films byin situtransmission electron microscopy

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      Applied Physics Letters

      AIP Publishing

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          The evolution of microstructure in Al-2 Pct Cu thin films: Precipitation, dissolution, and reprecipitation

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            Electromigration in fine‐line sputter‐gun Al

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              Formation of second phase particles in aluminum-copper alloy films

               S. Mader,  S Herd (1972)
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                Author and article information

                Journal
                Applied Physics Letters
                Appl. Phys. Lett.
                AIP Publishing
                0003-6951
                1077-3118
                February 07 1994
                February 07 1994
                : 64
                : 6
                : 721-723
                Article
                10.1063/1.111046
                © 1994
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