ScienceOpen:
research and publishing network
For Publishers
Discovery
Metadata
Peer review
Hosting
Publishing
For Researchers
Join
Publish
Review
Collect
My ScienceOpen
Sign in
Register
Dashboard
Blog
About
Search
Advanced search
My ScienceOpen
Sign in
Register
Dashboard
Search
Search
Advanced search
For Publishers
Discovery
Metadata
Peer review
Hosting
Publishing
For Researchers
Join
Publish
Review
Collect
Blog
About
1
views
0
references
Top references
cited by
14
Cite as...
0 reviews
Review
0
comments
Comment
0
recommends
+1
Recommend
0
collections
Add to
0
shares
Share
Twitter
Sina Weibo
Facebook
Email
2,270
similar
All similar
Record
: found
Abstract
: not found
Article
: not found
Electromigration and crevice formation in thin metallic films
Author(s):
I.A. Blech
Publication date
Created:
November 1972
Publication date
(Print):
November 1972
Journal:
Thin Solid Films
Publisher:
Elsevier BV
Read this article at
ScienceOpen
Publisher
Review
Review article
Invite someone to review
Bookmark
Cite as...
There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.
Related collections
ScienceOpen Research
Author and article information
Journal
Title:
Thin Solid Films
Abbreviated Title:
Thin Solid Films
Publisher:
Elsevier BV
ISSN (Print):
00406090
Publication date Created:
November 1972
Publication date (Print):
November 1972
Volume
: 13
Issue
: 1
Pages
: 117-129
Article
DOI:
10.1016/0040-6090(72)90164-2
SO-VID:
516747c9-ad78-482b-9380-dfd5c5a6cac7
Copyright ©
© 1972
License:
http://www.elsevier.com/tdm/userlicense/1.0/
History
Data availability:
Comments
Comment on this article
Sign in to comment
scite_
Similar content
2,270
The Lichen Flora of Shaded Acid Rock Crevices and Overhangs in Britain
Authors:
P. JAMES
,
PW James
Marker Motion during Electromigration in Thin Films
Authors:
M. OHRING
,
P. SUN
,
M. Ohring
VALUE D0Z* FOR GRAIN BOUNDARY ELECTROMIGRATION IN ALUMINUM FILMS
Authors:
R. Rosenberg
See all similar
Cited by
14
Electromigration in thin aluminum films on titanium nitride
Authors:
I. A. Blech
Physical limits in digital electronics
Authors:
R.W. Keyes
Electromigration in integrated circuit conductors
Authors:
J. Lloyd
See all cited by