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      Study on the influence of standoff distance on substrate damage under an abrasive water jet process by molecular dynamics simulation

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          Abstract

          The process of a cluster-containing water jet impinging on a monocrystalline silicon substrate was studied by molecular dynamics simulation. The results show that as the standoff distance increases, the jet will gradually diverge. As a result, the solidified water film between the cluster and the substrate becomes “thicker” and “looser”. The “thicker” and “looser” water film will then consume more input energy to achieve complete solidification, resulting in the stress region and the high-pressure region of the silicon substrate under small standoff distances to be significantly larger than those under large standoff distances. Therefore, the degree of damage sustained by the substrate will first experience a small change and then decrease quickly as the standoff distance increases. In summary, the occurrence and maintenance of complete solidification of the confined water film between the cluster and the substrate plays a decisive role in the level of damage formation on the silicon substrate. These findings are helpful for exploring the mechanism of an abrasive water jet.

          Most cited references33

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          Crystal data for high-pressure phases of silicon

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            Nonequilibrium molecular dynamics via Gauss's principle of least constraint

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              Molecular Dynamics Simulations of Water Structure and Diffusion in Silica Nanopores

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                Author and article information

                Journal
                Tsinghua Science and Technology
                Friction
                Tsinghua University Press (Xueyuan Building, Tsinghua University, Beijing 100084, China )
                2223-7690
                05 June 2018
                : 06
                : 02
                : 195-207 (pp. )
                Affiliations
                [ 1 ] College of Mechanical Engineering, Donghua University, Shanghai 201620, China
                [ 2 ] Nano-Science and Technology Research Center, Shanghai University, Shanghai 200444, China
                Author notes
                * Corresponding author: Ruling CHEN, E-mail: chen_ruling@ 123456163.com

                §  These authors contributed equally to this paper

                Ruling CHEN. He received his Ph.D. degree in mechanical engineering from the Tsinghua University in China in 2009. Now he is an associate professor at Donghua University. His research areas cover the nanotribology, ultra-precision surface machining/etc.

                Di ZHANG. Master student in inorganic chemistry major at the Shanghai University. His research interest is molecular dynamics simulation and ultra- precision surface machining.

                Article
                2223-7690-06-02-195
                10.1007/s40544-017-0168-4
                5a586ad2-c7eb-4214-ab5e-e00d9e623273

                This work is licensed under a Creative Commons Attribution 4.0 Unported License. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/

                History
                : 09 February 2017
                : 09 May 2017
                : 22 May 2017
                Page count
                Figures: 14, Tables: 0, References: 35, Pages: 13
                Categories
                Research Article

                Materials technology,Materials properties,Thin films & surfaces,Mechanical engineering
                abrasive water jet,standoff distance,crystalline silicon substrate,molecular dynamics simulation

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