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      Large area bonding for power devices by pillar-like IMC effective dispersion control

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      Science Impact, Ltd.

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          Abstract

          Electronic packaging is extremely important, not least to protect the precious electronic devices inside. And these precious devices, in turn, are used to build important industrial products such as automobiles and smart grid systems, for example. It makes sense, then, that high-quality electronic packaging and the technologies used to produce it is paramount. In Japan, electronic packaging technology is known as 'Jisso' and can be defined as a key technology supporting the development of electronic devices. A team of Japanese researchers is investigating bonding methodologies, structures and materials for electronics packaging, as well as shedding light on the effect of microstructures on the mechanical properties and reliability of joints.

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          Author and article information

          Journal
          Impact
          impact
          Science Impact, Ltd.
          2398-7073
          February 27 2020
          February 27 2020
          : 2020
          : 1
          : 76-78
          Article
          10.21820/23987073.2020.1.76
          © 2020

          This work is licensed under a Creative Commons Attribution 4.0 Unported License. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/

          Earth & Environmental sciences, Medicine, Computer science, Agriculture, Engineering

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