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      Tuning the heat resistance properties of polyimides by intermolecular interaction strengthening for flexible substrate application

      Author(s): , , ,
      Publication date Created:
      Publication date (Print):
      Journal: Polymer
      Publisher: Elsevier BV

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          Journal
          Title: Polymer
          Abbreviated Title: Polymer
          Publisher: Elsevier BV
          ISSN (Print): 00323861
          Publication date Created: April 2019
          Publication date (Print): April 2019
          Article
          DOI: 10.1016/j.polymer.2019.04.032
          SO-VID: 6183b197-a06a-4e18-b133-596eee27ecfe
          Copyright © © 2019
          License:

          https://www.elsevier.com/tdm/userlicense/1.0/

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