Embedded Trench Redistribution Layers at 2– $5~\mu \text{m}$ Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20– $40~\mu \text{m}$ I/O Pitch Interposers

Suzuki, Yuya; Hichri, Habib; Wei, Frank; Sundaram, Venky; Tummala, Rao

doi:10.1109/TCPMT.2017.2676023

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Embedded Trench Redistribution Layers at 2– $5~\mu \text{m}$Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20– $40~\mu \text{m}$ I/O Pitch Interposers

Author(s): Yuya Suzuki , Habib Hichri , Frank Wei , Venky Sundaram , Rao Tummala

Publication date (Print): June 2017

Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

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Title: IEEE Transactions on Components, Packaging and Manufacturing Technology

Abbreviated Title: IEEE Trans. Compon., Packag. Manufact. Technol.

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

ISSN (Print): 2156-3950

ISSN (Electronic): 2156-3985

Publication date Created: June 2017

Publication date (Print): June 2017

Volume: 7

Issue: 6

Pages: 838-845

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DOI: 10.1109/TCPMT.2017.2676023

SO-VID: 68e6e516-ac67-4352-8d59-1bd8a03048c0

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Self URI (article page): http://ieeexplore.ieee.org/document/7883902/

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Embedded Trench Redistribution Layers at 2– $5~\mu \text{m}\(Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20– \)40~\mu \text{m}$ I/O Pitch Interposers

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