For Publishers
DiscoveryMetadataPeer reviewHostingPublishing
For Researchers
JoinPublishReviewCollect
Register
Blog
About
Search
Advanced search
My ScienceOpen
Search
For Publishers
For Researchers
Blog
About
3
views
29
references
 Top references
cited by
0
    
0 reviews
 Review
0
comments
 Comment
0
recommends
+1 Recommend
0 collections
    0
    shares
      2,867
      similar
       All similar
      • Record: found
      • Abstract: not found
      • Article: not found

      Prediction of Fatigue Resistance in Lead-Free Ni-Doped SAC 1205 Solder Alloys Using a Rate-Dependent Material Model and Subjected to Drop Tests

      Read this article at

      ScienceOpenPublisher
      Bookmark
          There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.

          Related collections

          Most cited references29

          • Record: found
          • Abstract: not found
          • Article: not found
          Is Open Access

          Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates

          Tong An, Fei Fei Qin (2014)
          Article 0 comments Cited 6 times – based on 0 reviews     Review now
            Bookmark
            • Record: found
            • Abstract: not found
            • Article: not found

            Dynamic material property characterization by using split Hopkinson pressure bar (SHPB) technique

            O.S. Lee, M.S. Kim (2003)
            Article 0 comments Cited 6 times – based on 0 reviews     Review now
              Bookmark
              • Record: found
              • Abstract: not found
              • Article: not found

              Impact life prediction modeling of TFBGA packages under board level drop test

              Tong Tee, Hun Shen Ng, Chwee Teck Lim … (2004)
              Article 0 comments Cited 6 times – based on 0 reviews     Review now
                Bookmark
                All references

                Author and article information

                Journal
                Title: IEEE Transactions on Components, Packaging and Manufacturing Technology
                Abbreviated Title: IEEE Trans. Compon., Packag. Manufact. Technol.
                Publisher: Institute of Electrical and Electronics Engineers (IEEE)
                ISSN (Print): 2156-3950
                ISSN (Electronic): 2156-3985
                Publication date Created: October 2018
                Publication date (Print): October 2018
                Volume: 8
                Issue: 10
                Pages: 1777-1787
                Article
                DOI: 10.1109/TCPMT.2018.2869248
                SO-VID: 6b8d8457-c252-48bf-89ac-4f6edfdcf107
                Copyright © © 2018
                History

                Data availability:

                Comments

                Comment on this article