There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.

Related collections

Author and article information

Journal

DOI:: 10.1557/JMR.2002.0082

Data availability:

Comments

Comment on this article

scite_

Cited by 5

Size-Dependent Resistivity in Nanoscale Interconnects
Authors: Daniel Josell, Sywert H Brongersma, Zsolt Tőkei
Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions
Authors: S. Brongersma, W. Wu, M Van Hove …
On the root cause of Kirkendall voiding in Cu3Sn
Authors: Liang Yin, Peter Borgesen

See all cited by

Grain Growth, Stress, and Impurities in Electroplated Copper

Read this article at