Thermoelastic analysis of a cracked strip under thermal impact based on memory-dependent heat conduction model

Chen, Zeng-Tao; Tian, Xiao-Geng; Xue, Zhang-Na

doi:10.1016/j.engfracmech.2018.08.018

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Thermoelastic analysis of a cracked strip under thermal impact based on memory-dependent heat conduction model

Author(s): Zhang-Na Xue , Zeng-Tao Chen , Xiao-Geng Tian

Publication date Created: September 2018

Publication date (Print): September 2018

Journal: Engineering Fracture Mechanics

Publisher: Elsevier BV

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Title: Engineering Fracture Mechanics

Abbreviated Title: Engineering Fracture Mechanics

Publisher: Elsevier BV

ISSN (Print): 00137944

Publication date Created: September 2018

Publication date (Print): September 2018

Volume: 200

Pages: 479-498

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DOI: 10.1016/j.engfracmech.2018.08.018

SO-VID: 79ab1831-14c4-42b5-8df2-657b174155fd

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https://www.elsevier.com/tdm/userlicense/1.0/

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