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      Morphology and adhesion strength in electroless Cu metallized AlN substrate

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          Journal
          IEEE Transactions on Components, Hybrids, and Manufacturing Technology
          IEEE Trans. Comp., Hybrids, Manufact. Technol.
          Institute of Electrical and Electronics Engineers (IEEE)
          01486411
          Dec. 1993
          : 16
          : 8
          : 1012-1020
          Article
          10.1109/33.273704
          7ce7d8d8-010a-4294-8532-23ca42898d16
          © 1993
          History

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