Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites

Tanaka, Toshikatsu; Huang, Xingyi; Ohki, Yoshimichi; Jiang, Pingkai; Iizuka, Tomonori

doi:10.1021/jp3026545

Record: found
Abstract: not found
Article: not found

Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites

Author(s): Xingyi Huang , Tomonori Iizuka , Pingkai Jiang , Yoshimichi Ohki , Toshikatsu Tanaka

Publication date Created: June 18 2012

Publication date (Print): June 14 2012

Journal: The Journal of Physical Chemistry C

Publisher: American Chemical Society (ACS)

Read this article at

ScienceOpenPublisher

Bookmark

There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.

Related collections

Author and article information

Journal

Title: The Journal of Physical Chemistry C

Abbreviated Title: J. Phys. Chem. C

Publisher: American Chemical Society (ACS)

ISSN (Print): 1932-7447

ISSN (Electronic): 1932-7455

Publication date Created: June 18 2012

Publication date (Print): June 14 2012

Volume: 116

Issue: 25

Pages: 13629-13639

Article

DOI: 10.1021/jp3026545

SO-VID: 7e38188f-6323-4241-a415-19c0521295f5

History

Data availability:

Comments

Comment on this article

scite_

Cited by 86

See all cited by

Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites

Read this article at

Related collections

Shewanella

Author and article information

Journal

Article

History

Comments

Comment on this article

Similar content 1,838

Cited by 86