Effect of bonding temperature on isothermal solidification rate during transient liquid phase bonding of Inconel 738LC superalloy

Idowu, O.A; Richards, N.L.; Chaturvedi, M.C.

doi:10.1016/j.msea.2005.01.055

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Effect of bonding temperature on isothermal solidification rate during transient liquid phase bonding of Inconel 738LC superalloy

Author(s): O.A. Idowu , N.L. Richards , M.C. Chaturvedi

Publication date Created: April 2005

Publication date (Print): April 2005

Journal: Materials Science and Engineering: A

Publisher: Elsevier BV

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Title: Materials Science and Engineering: A

Abbreviated Title: Materials Science and Engineering: A

Publisher: Elsevier BV

ISSN (Print): 09215093

Publication date Created: April 2005

Publication date (Print): April 2005

Volume: 397

Issue: 1-2

Pages: 98-112

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DOI: 10.1016/j.msea.2005.01.055

SO-VID: 7fde3727-d5ba-4976-a77d-e221d4ea8d3a

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Effect of bonding temperature on isothermal solidification rate during transient liquid phase bonding of Inconel 738LC superalloy

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