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      Self-healing, anti-freezing, adhesive and remoldable hydrogel sensor with ion-liquid metal dual conductivity for biomimetic skin

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      Composites Science and Technology
      Elsevier BV

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          Hydrogel ionotronics

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            One-step assembly of coordination complexes for versatile film and particle engineering.

            The development of facile and versatile strategies for thin-film and particle engineering is of immense scientific interest. However, few methods can conformally coat substrates of different composition, size, shape, and structure. We report the one-step coating of various interfaces using coordination complexes of natural polyphenols and Fe(III) ions. Film formation is initiated by the adsorption of the polyphenol and directed by pH-dependent, multivalent coordination bonding. Aqueous deposition is performed on a range of planar as well as inorganic, organic, and biological particle templates, demonstrating an extremely rapid technique for producing structurally diverse, thin films and capsules that can disassemble. The ease, low cost, and scalability of the assembly process, combined with pH responsiveness and negligible cytotoxicity, makes these films potential candidates for biomedical and environmental applications.
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              Carbonized Silk Fabric for Ultrastretchable, Highly Sensitive, and Wearable Strain Sensors.

              A carbonized plain-weave silk fabric is fabricated into wearable and robust strain sensors, which can be stretched up to 500% and show high sensitivity in a wide strain range. This sensor can be assembled into wearable devices for detection of both large and subtle human activities, showing great potential for monitoring human motions and personal health.
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                Author and article information

                Journal
                Composites Science and Technology
                Composites Science and Technology
                Elsevier BV
                02663538
                February 2021
                February 2021
                : 203
                : 108608
                Article
                10.1016/j.compscitech.2020.108608
                8064071a-849a-46e7-9477-6321c08b06bb
                © 2021

                https://www.elsevier.com/tdm/userlicense/1.0/

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