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      Swing-like pool boiling on nano-textured surfaces for microgravity applications related to cooling of high-power microelectronics

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          Abstract

          Here, we demonstrate that heat removed in pool boiling from a heater mimicking high-power microelectronics could be used to facilitate a swing-like motion of the heater before being finally dissipated. This swing-like motion could be beneficial for shedding a large vapor bubble that encapsulates high-power heaters in microgravity where buoyancy force is unavailable for vapor bubble removal. The swing-like motion is propelled by vapor bubble recoil, the force which exists irrespective of gravity and buoyancy. We also demonstrate that this force could be significantly enhanced by depositing on the heater surface supersonically blown polymer nanofibers with cross-sectional diameters below 100 nm. These nanofibers provide additional nucleation sites, resulting in much more frequent bubble nucleation and departure, and thus a higher overall vapor recoil force propelling the heater motion. Such nanofibers strongly adhere to the heater surface and withstand prolonged harsh pool boiling. The measured velocity of the model swing-like heater in Novec 7300 fluid is about 1 cm/s.

          Cooling microelectronics with nanofibers

          As microelectronics get smaller, there is an urgent need to develop efficient methods to keep them cool without extra power input. Under normal gravity, excess heat can be removed by vapor bubbles rising through a coolant. In space however, due to the lack buoyancy force, vapor bubbles remain attached to the submerged heater and prevent heat removal. Prof. Alexander Yarin, at the University of Illinois at Chicago, and his team show that in heaters mimicking high-power microelectronics, the thrust of vapor bubble release (the vapor recoil force, which exists irrespective of gravity) helps shedding merger vapor bubbles by generating a swing-like motion of the heater. Moreover, they demonstrate how nanofiber coatings can increase heat transfer by providing more bubble nucleation sites, and thus enhance the swing-like motion.

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          Most cited references44

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          Synthetic molecular motors and mechanical machines.

          The widespread use of controlled molecular-level motion in key natural processes suggests that great rewards could come from bridging the gap between the present generation of synthetic molecular systems, which by and large rely upon electronic and chemical effects to carry out their functions, and the machines of the macroscopic world, which utilize the synchronized movements of smaller parts to perform specific tasks. This is a scientific area of great contemporary interest and extraordinary recent growth, yet the notion of molecular-level machines dates back to a time when the ideas surrounding the statistical nature of matter and the laws of thermodynamics were first being formulated. Here we outline the exciting successes in taming molecular-level movement thus far, the underlying principles that all experimental designs must follow, and the early progress made towards utilizing synthetic molecular structures to perform tasks using mechanical motion. We also highlight some of the issues and challenges that still need to be overcome.
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            Molecular motors.

            Life implies movement. Most forms of movement in the living world are powered by tiny protein machines known as molecular motors. Among the best known are motors that use sophisticated intramolecular amplification mechanisms to take nanometre steps along protein tracks in the cytoplasm. These motors transport a wide variety of cargo, power cell locomotion, drive cell division and, when combined in large ensembles, allow organisms to move. Motor defects can lead to severe diseases or may even be lethal. Basic principles of motor design and mechanism have now been derived, and an understanding of their complex cellular roles is emerging.
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              On-chip cooling by superlattice-based thin-film thermoelectrics.

              There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.
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                Author and article information

                Contributors
                +1(312) 996-3472 , ayarin@uic.edu
                Journal
                NPJ Microgravity
                NPJ Microgravity
                NPJ Microgravity
                Nature Publishing Group UK (London )
                2373-8065
                5 March 2017
                5 March 2017
                2017
                : 3
                : 9
                Affiliations
                [1 ]ISNI 0000 0001 2175 0319, GRID grid.185648.6, Department of Mechanical and Industrial Engineering, , University of Illinois at Chicago, ; Chicago, IL 60607-7022 USA
                [2 ]ISNI 0000 0004 1936 8227, GRID grid.25073.33, Department of Mechanical Engineering, , McMaster University, ; 1280 Main Street West, Hamilton, ON L8S 4L7 Canada
                [3 ]Corporate Innovation Center, United States Gypsum, 700 US 45 N, Libertyville, IL 60048 USA
                [4 ]ISNI 0000 0004 1769 7721, GRID grid.450280.b, Department of Materials Science and Engineering, , Indian Institute of Technology, ; Indore, Madhya Pradesh 452017 India
                Article
                14
                10.1038/s41526-017-0014-z
                5460202
                28649623
                80b03d56-a987-49db-b9e7-119a5672ca3f
                © The Author(s) 2017

                This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/

                History
                : 16 November 2016
                : 12 January 2017
                : 16 January 2017
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                © The Author(s) 2017

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