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      Ion beam nanopatterning of III-V semiconductors: consistency of experimental and simulation trends within a chemistry-driven theory

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          Abstract

          Several proposed mechanisms and theoretical models exist concerning nanostructure evolution on III-V semiconductors (particularly GaSb) via ion beam irradiation. However, making quantitative contact between experiment on the one hand and model-parameter dependent predictions from different theories on the other is usually difficult. In this study, we take a different approach and provide an experimental investigation with a range of targets (GaSb, GaAs, GaP) and ion species (Ne, Ar, Kr, Xe) to determine new parametric trends regarding nanostructure evolution. Concurrently, atomistic simulations using binary collision approximation over the same ion/target combinations were performed to determine parametric trends on several quantities related to existing model. A comparison of experimental and numerical trends reveals that the two are broadly consistent under the assumption that instabilities are driven by chemical instability based on phase separation. Furthermore, the atomistic simulations and a survey of material thermodynamic properties suggest that a plausible microscopic mechanism for this process is an ion-enhanced mobility associated with energy deposition by collision cascades.

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          Formation of Ordered Nanoscale Semiconductor Dots by Ion Sputtering.

          A formation process for semiconductor quantum dots based on a surface instability induced by ion sputtering under normal incidence is presented. Crystalline dots 35 nanometers in diameter and arranged in a regular hexagonal lattice were produced on gallium antimonide surfaces. The formation mechanism relies on a natural self-organization mechanism that occurs during the erosion of surfaces, which is based on the interplay between roughening induced by ion sputtering and smoothing due to surface diffusion.
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            Probing surface and interface morphology with Grazing Incidence Small Angle X-Ray Scattering

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              Dynamic Scaling of Ion-Sputtered Surfaces

              We derive a stochastic nonlinear equation to describe the evolution and scaling properties of surfaces eroded by ion bombardment. The coefficients appearing in the equation can be calculated explicitly in terms of the physical parameters characterizing the sputtering process. We find that transitions may take place between various scaling behaviors when experimental parameters such as the angle of incidence of the incoming ions or their average penetration depth, are varied.
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                Author and article information

                Journal
                Sci Rep
                Sci Rep
                Scientific Reports
                Nature Publishing Group
                2045-2322
                16 December 2015
                2015
                : 5
                : 18207
                Affiliations
                [1 ]School of Nuclear Engineering, Purdue University , West Lafayette, IN 47907
                [2 ]School of Materials Engineering, Purdue University , West Lafayette, IN 47907
                [3 ]Birck Nanotechnology Center , West Lafayette, IN 47907
                [4 ]Department of Mathematics, Southern Methodist University , Dallas, TX75275
                [5 ]Physics Department and Division of Materials Science and Engineering, Boston University , Boston, Massachusetts, 02215, USA
                [6 ]Department of Nuclear, Plasma and Radiological Engineering, University of Illinois at Urbana-Champaign , Urbana, IL, 61801
                Author notes
                [*]

                Present address: Materials Science and Engineering, Drexel University, Philadelphia, PA, 19406.

                Article
                srep18207
                10.1038/srep18207
                4680892
                26670948
                8515d97a-f571-4f39-a8c6-d5314abf1957
                Copyright © 2015, Macmillan Publishers Limited

                This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/

                History
                : 20 February 2015
                : 15 October 2015
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