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      Joining of Silicon Particle-Reinforced Aluminum Matrix Composites to Kovar Alloys Using Active Melt-Spun Ribbons in Vacuum Conditions

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          Abstract

          The vacuum brazing of dissimilar electronic packaging materials has been investigated. In this research, this applies silicon particle-reinforced aluminum matrix composites (Si p/Al MMCs) to Kovar alloys. Active melt-spun ribbons were employed as brazing filler metals under different joining temperatures and times. The results showed that the maximum joint shear strength of 96.62 MPa was achieved when the joint was made using Al-7.5Si-23.0Cu-2.0Ni-1.0Ti as the brazing filler metal at 580 °C for 30 min. X-ray diffraction (XRD) analysis of the joint indicated that the main phases were composed of Al, Si and intermetallics, including CuAl, TiFeSi, TiNiSi and Al 3Ti. When the brazing temperature ranged from 570 °C to 590 °C, the leakage rate of joints remained at 10 −8 Pa·m 3/s or better. When the joint was made using Al-7.5Si-23.0Cu-2.0Ni-2.5Ti as the brazing filler metal at 580 °C for 30 min, the higher level of Ti content in the brazing filler metal resulted in the formation of a flake-like Ti(AlSi) 3 intermetallic phase with an average size of 7 µm at the interface between the brazing seam and Si p/Al MMCs. The joint fracture was generally in the form of quasi-cleavage fracture, which primarily occurred at the interface between the filler metal and the Si p/Al MMCs. The micro-crack propagated not only Ti(AlSi) 3, but also the Si particles in the substrate.

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          Thermal conductivity of aluminum matrix composites reinforced with mixtures of diamond and SiC particles

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            Microstructure and thermal expansion behavior of Al-50Si synthesized by selective laser melting

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              New Nanocomposite Materials with Improved Mechanical Strength and Tailored Coefficient of Thermal Expansion for Electro-Packaging Applications

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                Author and article information

                Journal
                Materials (Basel)
                Materials (Basel)
                materials
                Materials
                MDPI
                1996-1944
                02 July 2020
                July 2020
                : 13
                : 13
                : 2965
                Affiliations
                [1 ]School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454003, China; baxianli112233@ 123456163.com (X.B.); yanghuanyuyhy@ 123456163.com (H.Y.); Ycx7469@ 123456163.com (C.Y.); niujitai@ 123456163.com (J.N.)
                [2 ]Beijing Institute of Aeronautical Materials, Beijing 100095, China; liusg621@ 123456126.com
                [3 ]School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
                [4 ]Faculty of Engineering, University of Rijeka, 51000 Rijeka, Croatia; brnic@ 123456riteh.hr
                Author notes
                [* ]Correspondence: mrgaozeng@ 123456163.com ; Tel.: +86-391-396-6901
                Article
                materials-13-02965
                10.3390/ma13132965
                7372364
                32630757
                8fba863c-28b9-403b-9ded-02e44d13e2c5
                © 2020 by the authors.

                Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license ( http://creativecommons.org/licenses/by/4.0/).

                History
                : 02 June 2020
                : 30 June 2020
                Categories
                Article

                sip/al mmcs,kovar,vacuum brazing,micro nano ribbon,microstructure

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