Selective Desoldering Separation of Tin–Lead Alloy for Dismantling of Electronic Components from Printed Circuit Boards

[1 ]School of Environmental and Materials Engineering, Shanghai Second Polytechnic University, Shanghai 201209, People’s Republic of China

[2 ]Integrated Composites Laboratory (ICL), Department of Chemical and Bimolecular Engineering, University of Tennessee, Knoxville, Tennessee 37996, United States