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      Influence of test procedure on dielectric breakdown strength of alumina

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          Abstract

          Dielectric strength testing of ceramics can be performed with various setups and parameters. Comparisons of results from different sources are often not meaningful, because the results are strongly dependent on the actual testing procedure. The aim of this study is to quantify the influence of voltage ramp rate, electrode size, electrode conditioning, and sample thickness on the measured AC dielectric strength of a commercial alumina. Mean values, Weibull moduli, and failure probabilities determined in standardized short time tests are evaluated and related to withstand voltage tests. Dielectric strength values in the range from 21.6 to 33.2 kV·mm −1 were obtained for the same material using different testing procedures. Short time tests resulted in small standard deviations (< 2 kV·mm −1) and high Weibull moduli around 30, while withstand tests at voltage levels with low and virtual zero failure probability in short time tests resulted in large scatter of withstand time and Weibull moduli < 1. The strong decrease in Weibull moduli is attributed to progressive damage from partial discharge and depolarization during AC testing. These findings emphasize the necessity of a thorough documentation of testing procedure and highlight the importance of withstand voltage tests for a comprehensive material characterization.

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          Author and article information

          Journal
          J Adv Ceram
          Journal of Advanced Ceramics
          Tsinghua University Press and Springer-Verlag Berlin Heidelberg (USA )
          2227-8508
          2226-4108
          01 June 2019
          01 October 2019
          : 8
          : 2
          : 247-255
          Affiliations
          aBundesanstalt fuer Materialforschung und -pruefung (BAM), Division Advanced Technical Ceramics, 12200 Berlin, Germany
          Author notes
          *Corresponding author: Bjoern MIELLER, E-mail: bjoern.mieller@ 123456bam.de
          Article
          s40145-018-0310-4
          10.1007/s40145-018-0310-4
          Copyright © The Author(s)

          This is an open-access article distributed under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited. See https://creativecommons.org/licenses/by/4.0/.

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