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Abstract
Electrodeposition of ceramic materials can be performed by electrophoretic (EPD) or
electrolytic (ELD) deposition. Electrophoretic deposition is achieved via motion of
charged particles towards an electrode under an applied electric field. Electrolytic
deposition produces colloidal particles in cathodic reactions for subsequent deposition.
Various electrochemical strategies and deposition mechanisms have been developed for
electrodeposition of ceramic and organoceramic films, and are discussed in the present
article. Electrode-position of ceramic and organoceramic materials includes mass transport,
accumulation of particles near the electrode and their coagulation to form a cathodic
deposit. Various types of interparticle forces that govern colloidal stability in
the absence and presence of processing additives are discussed. Novel theoretical
contributions towards an interpretation of particle coagulation near the electrode
surface are reviewed. Background information is given on the methods of particle charging,
stabilization of colloids in aqueous and non-aqueous media, electrophoretic mobility
of ceramic particles and polyelectrolytes, and electrode reactions. This review also
covers recent developments in the electrodeposition of ceramic and organoceramic materials.