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Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage
Author(s):
Zenglin Wang
,
Akihiko Furuya
,
Keiichirou Yasuda
,
Hideo IKEDA
,
Tomoyuki Baba
,
Muneaki Hagiwara
,
Sotaro Toki
,
Shoso Shingubara
,
Hiroshi Kubota
,
Tadahiro Ohmi
,
Z Wang
,
A Furuya
,
K YASUDA
,
H. Ikeda
,
T. Baba
,
M. Hagiwara
,
S. TOKI
,
S. SHINGUBARA
,
H. KUBOTA
,
T. Ohmi
Publication date:
2002
Journal:
Journal of Adhesion Science and Technology
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Photoluminescent Nanomaterials
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DOI::
10.1163/156856102760146147
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