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      Deformation behaviour of body centered cubic iron nanopillars containing coherent twin boundaries

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          Abstract

          Molecular dynamics simulations were performed to understand the role of twin boundaries on deformation behaviour of body-centred cubic (BCC) iron (Fe) nanopillars. The twin boundaries varying from one to five providing twin boundary spacing in the range 8.5 - 2.8 nm were introduced perpendicular to the loading direction. The simulation results indicated that the twin boundaries in BCC Fe play a contrasting role during deformation under tensile and compressive loadings. During tensile deformation, a large reduction in yield stress was observed in twinned nanopillars compared to perfect nanopillar. However, the yield stress exhibited only marginal variation with respect to twin boundary spacing. On the contrary, a decrease in yield stress with increase in twin boundary spacing was obtained during compressive deformation. This contrasting behaviour originates from difference in operating mechanisms during yielding and subsequent plastic deformation. It has been observed that the deformation under tensile loading was dominated mainly by twin growth mechanism, due to which the twin boundaries offers a negligible resistance to slip of twinning partials. This is reflected in the negligible variation of yield stress as a function of twin boundary spacing. On the other hand, the deformation was dominated by nucleation and slip of full dislocations under compressive loading. The twin boundaries offer a strong repulsive force on full dislocations resulting in the yield stress dependence on twin boundary spacing. Further, it has been observed that the curved twin boundary can acts as a source for full dislocation. The occurrence of twin-twin interaction during tensile deformation and dislocation-twin interaction during compressive deformation were presented and discussed.

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          Most cited references 42

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              Ultrahigh strength and high electrical conductivity in copper.

              Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries.
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                Author and article information

                Journal
                2016-11-17
                10.1080/14786435.2016.1240377
                1611.05575

                http://arxiv.org/licenses/nonexclusive-distrib/1.0/

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                Philosophical Magazine 96 (2016) 3502-3523
                21 Pages, 18 Figures, Journal article
                cond-mat.mtrl-sci

                Condensed matter

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