Currently most microelectromechanical systems (MEMS) devices are fabricated on either silicon wafers or using a silicon-on-insulator (SOI) process. However, for applications where larger areas are desired, such as displays, the 450mm maximum size of a silicon wafer is not sufficient. The low processing temperatures of thin film technology, together with the large area capabilities and generic compatibility with standard microelectronics processes, opens up a wide variety of options for compatible substrates. This can be critical for developing new applications where it is necessary to have substrates that have a large area, are transparent, unbreakable, flexible, light weight or biocompatible, conditions which cannot be met by silicon substrates. A collaborative project called uMEMS is looking at these opportunities for future use of MEMS technology. uMEMS is a joint effort between INESC Microsystems and Nanotechnologies (INESC MN) and the International Iberian Nanotechnology Laboratory (INL). Their work, says Dr Virginia Chu who is coordinating the project, aims to demonstrate how thin-film silicon MEMS resonators on large area glass and flexible polymer substrates can be integrated to their control electronics through a hybrid technology that will allow microfabricated interfacing between the MEMS and the Integrated Circuit (IC). ‘The key aspect of this demonstration will be to develop oscillators integrating thin-film silicon MEMS resonators as their frequency setting component. We believe that the results of this project, if successful, will allow CMOS backend-compatible MEMS resonators for monolithic integration in ‘more-than-Moore’ sensing applications. It will also enable electronically addressed MEMS oscillator arrays for mass transduction in air and water for sensing; and opening the way to high-density arrayable oscillators for novel applications on large area or flexible substrate.