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      A Porous Scaffold Design Method for Bone Tissue Engineering Using Triply Periodic Minimal Surfaces

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          Ti-6Al-4V triply periodic minimal surface structures for bone implants fabricated via selective laser melting.

          Triply periodic minimal surface (TPMS) structures have already been shown to be a versatile source of biomorphic scaffold designs. Therefore, in this work, Ti-6Al-4V Gyroid and Diamond TPMS lattices having an interconnected high porosity of 80-95% and pore sizes in the range of 560-1600 μm and 480-1450 μm respectively were manufactured by selective laser melting (SLM) for bone implants. The manufacturability, microstructure and mechanical properties of the Ti-6Al-4V TPMS lattices were evaluated. Comparison between 3D micro-CT reconstructed models and original CAD models of the Ti-6Al-4V TPMS lattices shows excellent reproduction of the designs. The as-built Ti-6Al-4V struts exhibit the microstructure of columnar grains filled with very fine and orthogonally oriented α' martensitic laths with the width of 100-300 nm and have the microhardness of 4.01 ± 0.34 GPa. After heat treatment at 680°C for 4h, the α' martensite was converted to a mixture of α and β, in which the α phase being the dominant fraction is present as fine laths with the width of 500-800 nm and separated by a small amount of narrow, interphase regions of dark β phase. Also, the microhardness is decreased to 3.71 ± 0.35 GPa due to the coarsening of the microstructure. The 80-95% porosity TPMS lattices exhibit a comparable porosity with trabecular bone, and the modulus is in the range of 0.12-1.25 GPa and thus can be adjusted to the modulus of trabecular bone. At the same range of porosity of 5-10%, the moduli of cortical bone and of the Ti-6Al-4V TPMS lattices are in a similar range. Therefore, the modulus and porosity of Ti-6Al-4V TPMS lattices can be tailored to the levels of human bones and thus reduce or avoid "stress shielding" and increase longevity of implants. Due to the biomorphic designs, and high interconnected porosity and stiffness comparable to human bones, SLM-made Ti-6Al-4V TPMS lattices can be a promising material for load bearing bone implants.
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            Hyperelastic "bone": A highly versatile, growth factor-free, osteoregenerative, scalable, and surgically friendly biomaterial.

            Despite substantial attention given to the development of osteoregenerative biomaterials, severe deficiencies remain in current products. These limitations include an inability to adequately, rapidly, and reproducibly regenerate new bone; high costs and limited manufacturing capacity; and lack of surgical ease of handling. To address these shortcomings, we generated a new, synthetic osteoregenerative biomaterial, hyperelastic "bone" (HB). HB, which is composed of 90 weight % (wt %) hydroxyapatite and 10 wt % polycaprolactone or poly(lactic-co-glycolic acid), could be rapidly three-dimensionally (3D) printed (up to 275 cm(3)/hour) from room temperature extruded liquid inks. The resulting 3D-printed HB exhibited elastic mechanical properties (~32 to 67% strain to failure, ~4 to 11 MPa elastic modulus), was highly absorbent (50% material porosity), supported cell viability and proliferation, and induced osteogenic differentiation of bone marrow-derived human mesenchymal stem cells cultured in vitro over 4 weeks without any osteo-inducing factors in the medium. We evaluated HB in vivo in a mouse subcutaneous implant model for material biocompatibility (7 and 35 days), in a rat posterolateral spinal fusion model for new bone formation (8 weeks), and in a large, non-human primate calvarial defect case study (4 weeks). HB did not elicit a negative immune response, became vascularized, quickly integrated with surrounding tissues, and rapidly ossified and supported new bone growth without the need for added biological factors.
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              Nodal surface approximations to the P,G,D and I-WP triply periodic minimal surfaces

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                Author and article information

                Journal
                IEEE Access
                IEEE Access
                Institute of Electrical and Electronics Engineers (IEEE)
                2169-3536
                2018
                2018
                : 6
                : 1015-1022
                Article
                10.1109/ACCESS.2017.2777521
                a7b1bd8f-6cb6-415d-b18a-796cc7df9e65
                © 2018
                History

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