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      All-in-one design integrates microfluidic cooling into electronic chips

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      Publication date (Electronic):
      Journal: Nature
      Publisher: Springer Science and Business Media LLC

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          High-performance heat sinking for VLSI

          D.B. Tuckerman, R.F.W. Pease (1981)
          Article 0 comments Cited 383 times – based on 0 reviews     Review now
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            Emerging challenges and materials for thermal management of electronics

            Li Xin Shi, Arden L Moore (2014)
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              Co-designing electronics with microfluidics for more sustainable cooling

              Remco van Erp, Reza Soleimanzadeh, Luca Nela … (2020)
              Article 0 comments Cited 68 times – based on 0 reviews     Review now
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                Author and article information

                Journal
                Title: Nature
                Abbreviated Title: Nature
                Publisher: Springer Science and Business Media LLC
                ISSN (Print): 0028-0836
                ISSN (Electronic): 1476-4687
                Publication date Created: September 10 2020
                Publication date (Electronic): September 09 2020
                Publication date (Print): September 10 2020
                Volume: 585
                Issue: 7824
                Pages: 188-189
                Article
                DOI: 10.1038/d41586-020-02503-1
                SO-VID: ad345a97-8ec5-4686-a83b-4ada79bb2e0b
                Copyright © © 2020
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                http://www.springer.com/tdm

                http://www.springer.com/tdm

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