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      214-Gb/s 4-PAM Operation of Flip-Chip Interconnection EADFB Laser Module

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          Journal
          Journal of Lightwave Technology
          J. Lightwave Technol.
          Institute of Electrical and Electronics Engineers (IEEE)
          0733-8724
          1558-2213
          February 2017
          February 1 2017
          : 35
          : 3
          : 418-422
          Article
          10.1109/JLT.2016.2632164
          b287ea4f-95f5-4e29-bcb0-f88d7cce1a98
          © 2017
          History

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