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      A Superfilling Model that Predicts Bump Formation

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      Electrochemical and Solid-State Letters
      The Electrochemical Society

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          Damascene copper electroplating for chip interconnections

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            Superconformal Electrodeposition of Copper

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              Superconformal Electrodeposition of Copper in 500–90 nm Features

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                Author and article information

                Journal
                ESLEF6
                Electrochemical and Solid-State Letters
                Electrochem. Solid-State Lett.
                The Electrochemical Society
                10990062
                2001
                2001
                : 4
                : 7
                : C50
                Article
                10.1149/1.1375856
                b5a55d8e-ffa0-4f7e-b613-f6605ccda409
                © 2001
                History

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