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      Development of electroplated Ni–xZn films for under bump metallization application

      Author(s): ,
      Publication date Created:
      Publication date (Print):
      Journal: Surface and Coatings Technology
      Publisher: Elsevier BV

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          Journal
          Title: Surface and Coatings Technology
          Abbreviated Title: Surface and Coatings Technology
          Publisher: Elsevier BV
          ISSN (Print): 02578972
          Publication date Created: December 2013
          Publication date (Print): December 2013
          Volume: 237
          Pages: 445-449
          Article
          DOI: 10.1016/j.surfcoat.2013.08.056
          SO-VID: b72db994-4759-403e-905f-33077f3c7cf7
          Copyright © © 2013
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