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      Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration

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          Author and article information

          Journal
          IEEE Electron Device Letters
          IEEE Electron Device Lett.
          Institute of Electrical and Electronics Engineers (IEEE)
          0741-3106
          1558-0563
          January 2016
          January 2016
          : 37
          : 1
          : 81-83
          Article
          10.1109/LED.2015.2502584
          b90fd63d-67ca-456f-b9ad-533b79d86e7c
          © 2016
          History

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