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945
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Oxide-free copper pastes for the attachment of large-area power devices
Author(s):
L. Del Carro
,
A.A. Zinn
,
P Ruch
,
F. Bouville
,
A.R STUDART
,
T. Brunschwiler
Publication date:
2019
Journal:
J. Electron. Mater.
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DOI::
10.1007/s11664-019-07452-8
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