1. Introduction
Wireless communication technologies are expected to constitute one of the most important
growth businesses in the world electronics industry during the balance of the 1990s;
current market projections are on the order of 50 % per year [1]. Digital wireless
communications (DWC) systems are syntheses of numerous key and supporting technologies
including wireless portable telephones, cellular telephone systems, portable personal
computers, data communications (“datacom”), global positioning systems (GPS), digital
signal processing (DSP), ultra-large-scale integrated (ULSI) circuits, silicon and
gallium arsenide microwave semiconductors, phase-locked loops (PLLs), direct signal
synthesis (DSS), and active digital filtering.
Wireless communication technologies incubated in the 1970s, evolved in the 1980s,
and are exploding in the 1990s. New technologies filling commercial bands above approximately
200 MHz are currently emerging at a rapid pace [2]. Although many factors helped spawn
the ongoing wireless revolution [3], the successful development of applications in
the 1980s can be traced to two key technical developments, one of which was AT&T’s
development [4] of Ba2Ti9O20, the first ceramic exhibiting the unique combination
of high dielectric constant, low dielectric loss, and minimal temperature dependence
of the dielectric constant [5]. Ceramics based on this material can be manufactured
with near-zero drift of resonant frequency with temperature and are key components
(i.e., resonators) in all base stations today [5]; phase equilibria diagrams serving
as “processing maps” for these materials were developed at the National Bureau of
Standards (NBS) [6], now NIST. A second key event was the introduction of the network
analyzer, allowing design engineers to rapidly and reliably evaluate the performance
of breadboard circuits. In turn, this guided the development of techniques to accurately
measure the intrinsic properties of dielectric resonator components at a wide range
of frequencies. Standard methods and reference materials have not yet been developed
for these types of measurements, a problem currently being addressed by NIST.
The ceramic requirements of microwave applications (e.g., filters, oscillators, resonators)
are critical and represent the single largest cost and size driver of the end devices.
Every modern commercial wireless communication and detection system in actual use
or in advanced development incorporates oxide ceramics with unique electrical properties.
Today, most of the new materials enabling dramatic advances in miniaturization and
performance of wireless equipment are the fruit of Japanese R&D programs. Japan continues
to lead in advanced electronic ceramics for the commercial wireless market. A 1990
report by then Secretary of Commerce Robert A. Mosbacher concluded that if existing
trends continued, by the year 2000 the United States would lag behind Japan in most
emerging electronic technologies and would trail the European community in several
of them. Many of the emerging technologies referenced in this report are immediately
associated with digital wireless communications technologies. A Japanese Technology
Evaluation Center panel report concluded in February 1995 that
Japan leads the United States in nearly every electronics packaging technology.
Japan has clearly achieved a strategic advantage in electronics production and process
technologies; Japanese competitors could be leading U.S. firms by as much as a decade
in some electronic process technologies.
This competitive advantage in electronics has been achieved as a consequence of developing
low-cost, high-volume consumer products.
Key factors in the success of Japan’s electronic industry are its infrastructure and
the remarkable cohesiveness of vision and purpose in government and industry.
In the foreseeable future, Japan will continue to dominate consumer electronics; however,
opportunities exist for the United States and other industrial countries to capture
an increasing share of the market.
No insurmountable barriers can be identified that prevent the United States from regaining
a significant share of the consumer electronics market; ample evidence indicates that
the United States needs to aggressively pursue high-volume, low-cost electronic assembly.
2. Objectives and Description of the Workshop
The primary goal of this workshop was to gather together a relatively small number
of individuals to identify, document, and prioritize key R&D needs which, if addressed,
would help U.S. businesses become more competitive in the global commercial wireless
market. A secondary goal was to obtain an overview of R&D needs in order to appropriately
focus in-house technical work at NIST. A target group size of 50 was deliberately
chosen in the hope that consensus could be reached on the prioritization of issues.
The 1 1/2-day workshop was co-chaired by T. A. Vanderah (NIST), T. Negas (Trans-Tech,
Inc.), W. Howng (Motorola Inc.), and R. G. Geyer (NIST). An invitational mailing list
of 85 was generated by informal networking among the organizers and key individuals
in industry and government. The invited group intentionally emphasized senior research
managers with a broad view of technical issues as well as senior research staff with
in-depth knowledge of technical issues. All invitees (62 % industry, 28 % government,
10 % academia) were given the opportunity to give a presentation. The NIST host site
was chosen as relatively neutral, and an informal, interactive atmosphere was specifically
encouraged in conference mailings.
Workshop literature stated the following topical emphases for the meeting: “The materials
issues will focus on ceramic requirements which comprise the single largest cost and
size drivers of end devices. In the area of measurements, the nature and need for
“standard methods” to quantify dielectric constant, quality factor, and temperature
coefficient of resonant frequency will serve as the focus.”
3. Content of the Workshop
The workshop attendance was 53 with the following profile: 51 % industry, 42 % government,
7 % academia. Representatives from the following companies attended:
AT&T
Bartley Machine
COMSAT
Concept Materials
Control Devices
Coors Ceramics
David Sarnoff Research Center
Ferro Corporation
GDK Products Dielectric Labs
Illinois Superconductor
MCV Technologies
Motorola
Penstock
Raytheon
Rogers Corporation
Trans-Tech
Individuals from NIST, Jet Propulsion Laboratory, Wright Patterson Air Force Laboratory,
Army Research Laboratory, Naval Research Laboratory, National Science Foundation,
University of Pennsylvania, and the University of Pittsburgh also attended.
The workshop was opened by the Director of NIST, Dr. Arati Prabhakar, who briefly
described the explosive growth of wireless communication technologies and the related
technical activities at NIST. The following oral presentations were given.
Commercial Patterns and Projections for the Wireless Communications Industry (J. Alberici,
President, Trans-Tech, Inc.)
Microwave Ceramics: Fit, Form, and Function (M. D. Evans, Concept Materials, Inc.)
Historical Perspective on Materials (H. M. O’Bryan, AT&T)
Current Status of Fundamental Knowledge: Structure, Chemistry, and Properties of Microwave
Ceramics (P. K. Davies, Univ. Pennsylvania)
Chemical Synthesis and Processing Issues for Microwave Dielectrics (P. Phule’, Univ.
Pittsburgh)
Ferrite Films by a Coat and Fire Process (J. J. Ritter, NIST/Gaithersburg)
Ferroelectric Oxide Ceramic Composites (L. Sengupta and S. Sengupta, Army Research
Laboratory)
Superconductors for Wireless Communications (J. Hodge, Illinois Superconductor)
Materials and Measurement Requirements for High-Temperature Superconducting Wireless
Communications Systems (M. Nisenoff, Naval Research Laboratory)
Ba2Ti9O20 Ceramics for Substrates (H. M. O’Bryan, AT&T)
An Assessment of “State of the Art” Electronic Packaging and Interconnections (D.
H. Knapke, Wright Patterson)
The NIST Program on Electromagnetic Characterization of Materials (C. M. Weil, NIST/Boulder)
Evaluation of Ceramics using Ring Resonator Measurements at Microwave Frequencies
(A. E. Fathy, David Sarnoff Research Center)
A Versatile Stripline Resonator Measurement Method Used at Rogers for Development
of PWB Substrates for Wireless Communications (G. R. Traut, Rogers Corp.)
The Case for Standard Dielectric Substrates (G. Kent, GDK Products)
The User’s Perspective: Need for Ferrite/Garnet Loss Measurements (J. Deriso, Trans-Tech,
Inc.)
Variable-Temperature Microwave Dielectric Properties of Isotropic and Anisotropic
Materials (R. G. Geyer, NIST, Boulder)
Some highlights from the oral presentations follow.
J. Alberici (President, Trans-Tech Inc.) gave a lively overview of the wireless communications
industry, which is 93 % commercial and 7 % defense. The wide variety of devices and
associated operating frequencies were described. Tremendous pressure exists to remain
globally competitive by reducing costs 20 % annually. At the same time, the demands
on processing control continue to increase as tolerances continue to decrease. Currently,
industry must provide components with tolerances of ± 0.25 % in permittivity and temperature
stability (of resonant frequency) of at least 0.25×10−6 °C−1 just to “stay in business.”
Alberici described the relentless pressure to be “smaller, cheaper, and better.” Concerning
the overall availability of resources for R&D, this speaker stated that if programs
such as the Advanced Technology Program (ATP) at NIST and similar programs at ARPA
disappear, “the effect on U.S. technology could be devastating.” In discussion that
followed, the ATP program at NIST and the TRP program at ARPA were compared to the
Japanese MITI program. Conference participants who had worked in Japan suggested that
MITI is a strong coordinating influence, and that high-risk R&D is subsidized by the
Japanese government. Alberici stated that investors’ demands for a certain level of
return has led to a situation in which U.S. industry cannot afford high-risk R&D.
The following speaker, M. D. Evans (Concept Materials), mentioned the existence of
the consortium RACE, Research for Advanced Communications in Europe, as being comparable
to the Japanese MITI, and for which the United States has no counterpart. Detailed
descriptions followed of each type of application, its state-of-the-art, and which
materials are used. This speaker described the “enormous entry barrier,” i.e., the
absence or immaturity of supporting technologies, that exists for the United States
in the area of SAW (Surface Acoustic Wave) resonator technology. A list of the major
players in this technology was given, some 30 Japanese and European companies, which
were described as having a “strong support structure of government, academia, and
industry.” The following summary of the current status of microwave materials was
given:
A variety of materials including polymers and ceramics such as ferrites, titanates,
and piezoelectrics are required for base stations, terminals, and applications not
yet envisioned.
Consistent property information is needed. Scientific evaluation of process-structure-property
evaluation (phase diagrams, mechanical analysis, physical property measurements) must
be increased to develop more useful models for design. Work is needed to fill the
gaps in property information databases.
Manufacturing methods must be improved to enhance automation capabilities. Higher
product velocities, improved in situ measurement methods, and better processing control
are needed to improve productivity and quickly respond to wireless application evolution.
Key factors here are process simplicity, full-stream (including life cycle) integration,
and improvements to fundamental design implementation.
Alternative filter technologies and innovation are needed. Analysis of piezoelectric
deposited structures and studies of single-crystal SAW/BAW (Surface Acoustic Wave/Bulk
Acoustic Wave) architecture are needed to promote design evolution.
Alternative packaging technologies and innovation are needed. Packaging is a critical
ingredient for managing the costs of emerging microwave component technologies. Miniaturization
is a continuing trend and methods of managing heat, corrosion, and costs will continue
to be essential elements for growth and profitability.
Research, development, and evaluation need to be product-focused. Manufacturing agility
will be favored by spectrum dynamics (i.e., rapid changes in frequencies associated
with applications). Market fluctuation and regulatory indecision can result in lost
business.
P. K. Davies (U. Penn.) presented an overview of the state-of-the-art in the fundamental
understanding of the structural and chemical basis of dielectric performance. An analysis
of the relevant scientific literature was given that indicated no significant increase
in the number of published research papers on this topic over the last 10 years; Japan
continues to produce approximately 70 % of the publications; the United States, 10
%. It was pointed out that most microwave ceramic development is taking place outside
the United States by Japan, Germany, Yugoslavia, and Russia, with an increasing number
of active groups developing in Korea. Japan dominates in the funding of research and
development of advanced microwave ceramics. In the United States, little basic research
in this area receives federal support and industrial support for studies of “fundamentals”
is scant. The speaker continued with a presentation of technical results on the relation
of defect structural chemistry to dielectric performance. The results indicated that
temperature stability (of resonant frequency) clearly has a structural basis. Correlations
are beginning to accumulate for dielectric constant and temperature coefficient; however,
almost nothing is understood about the chemical-structural basis for Q (quality factor;
dielectric loss). Overall, the fundamental aspects of most microwave ceramics remain
poorly understood with regards to predictive chemical control of dielectric performance.
In the discussion period scheduled after these talks a lively debate took place over
the degree of leadership the United States should strive for given the ever-increasing
global nature of the economy. The question was posed (and not definitively answered)
as to what is a healthy level of in-house capability vs. foreign dependence. It was
pointed out that customers are a primary source/driver for innovation and that they
need to be close to manufacturers. In a general discussion of the role of the national
labs, an opinion was offered that their impact is limited by intellectual property
issues.
G. Kent (GDK Products, Dielectric Labs) described the needs and methods to establish
traceability of permittivity measurements. Two major difficulties are encountered
owing to the variety of materials and the variety of techniques that exist to make
the measurements. Standard substrates are needed for traceability and for calibration;
it was suggested that they need not meet all the demanding specifications of standard
reference materials [7], but that they should be readily available and inexpensive.
An approach was suggested that combines the emphasis on standard materials (National
Physical Laboratory (UK) and NIST) and an emphasis on standard measurement techniques
(ASTM). Standard substrates, not necessarily substrates cut from standard materials,
should be mechanically flat with uniform thickness and minimum defects, exhibit minimum
anisotropy in dielectric properties with permittivity values up to 300 and loss tangents
less than 0.02, and have a low enough cost to make them readily available. A round-robin
type approach was suggested among different laboratories using various techniques
for comparative measurements.
J. Deriso (Trans-Tech) described the measurement challenges for microwave ferrites
used in high volume for circulators in commercial cellular and PCS (personal communications
services) radio applications. He described one customer as using 24 000 disks per
week, four per device for one product alone. The manufacturers’ quality-control issues
in meeting customer specifications include whether: 1) the measurement matches the
customer’s geometry, 2) the measurement is conducted at or near the customer’s frequency
and with the same magnetic bias, 3) the measurement can be carried out rapidly to
facilitate frequent sampling, 4) the measurement can be carried out easily by a production
technician, and 5) meaningful data can be obtained without resorting to exotic and
highly expensive equipment (e.g., vibrating sample magnetometers).
Potential applications of high-temperature superconductors as improved frequency-selective
filters for wireless communications were described by J. Hodge (Illinois Superconductor)
and M. Nisenoff (Naval Research Laboratory). The promising advantages of reduced weight,
volume, and electrical insertion loss, and a sharper frequency roll-off at band edges
(permitting a larger number of useful channels) were described in detail. In addition,
base stations could be farther apart. The major drawback and the key to cost feasibility
is low-cost cryogenic technology, which continues to develop. A consensus was expressed
that these materials have promise for future applications.
Roundtable Discussion: Prior to adjourning, approximately 2 hours were spent compiling
two lists of R&D issues in the areas of materials and measurements. Considerable interactive
discussion accompanied this process; points brought out by participants during this
session include the following:
In terms of general electronics technology, the 10–20 year future trends are toward
multilayer architecture and elimination of discrete components.
High-temperature superconductors have a promising future pending the evolution of
cryogenic technology.
The materials science of ceramic-metal interfaces will be increasingly important.
U.S. industry should collaborate and share information, but anti-trust laws will be
a hindrance.
The “T” in NIST suggests that NIST may have a uniquely appropriate mission to investigate
how small, highly successful entreprenurial companies operate to overcome obstacles
to global competitiveness. For example, how is the volume/cost problem handled, and
can lessons be learned by other U.S. industries to enhance their global competitiveness?
Concerning the appropriate focus of federal laboratory research with regard to proprietary
issues, one participant from a leading U.S. industry stated “Give us better tools
to do proprietary work.”
Another participant from a leading U.S. company suggested that this workshop was a
success, that the next meeting should be to specifically bring industrial players
together to share information, and that this would be a major factor in evening the
playing field with Japan: Japanese industry shares information and minimizes duplication.
It was suggested that anti-trust concerns may be reduced with NIST organizing such
a meeting, and that NIST staff should visit companies and document the duplication:
“Management will respond when the extent of duplicated efforts is known.”
4. Results of the Workshop
After the workshop, the lists of R&D issues were mailed to industry-affililated participants
who were asked to assign each issue between 0 and 10 points, 10 representing the highest
importance and most urgent. Participants were specifically asked to disregard the
issue of who should do the work and where the associated resources should come from.
Twenty-one responses were received from the 27 industry-affiliated participants. This
survey was intended to be qualitative and no attempt was made to statistically analyze
the responses. The prioritized lists are given below. The issues are ranked in descending
order of importance and urgency; in addition, the numerical values of the rankings
are relative to the differences between the total points awarded to each issue (ranking
1 = highest total points).
4.1 Survey Results
Materials Issues
1
Fundamentals: understanding relationships between chemistry, crystal structure, and
dielectric properties (ε
r, τf, Q)1
2
2 Phase diagrams of pertinent ceramic systems
2
2 Advanced ceramics; discovery of compositions with ε
r > 150, τf ≈ 0, high Q
2
2 Reaction kinetics during reactive sintering
3
Grain-boundaries: characterize chemistry and properties
4
Vapor pressures of volatile dopants to microwave ceramics
4
Micro-cracking: relate bulk to intrinsic properties
6
Interfaces
Measurements Issues
1
Standard materials for ε
r, τf, Q
1
Standard measurement techniques; update ASTM and “educate” (ε
r, τf, Q)
1
Nondestructive, customer’s geometry, variable frequency/temperature simple “assembly-line”
methods to evaluate dielectric properties
2
Critically compile/evaluate database of intrinsic properties of well-characterized
materials ε
r, τf, thermal expansion, conductivity, specific heat)
3
Evaluation of foreign measurement methods and critical evaluation of all methods
5
Relative “in situ” measurements (Go/No Go) of various properties
5
Room-temperature→300 °C anisotropic thermal expansion measurements by high-temperature
x-ray diffraction
5
Non-destructive mechanical adhesion test methods
5
Surface measurements; convenient standard for variable power surface resistance
5. Wrap-Up and Feedback
The workshop was attended by a number of individuals from companies expressing interest
in or intentions of entering the microwave ceramic market or immediately supporting
markets. Recently, Coors Ceramics Electronic Products Group announced [8] the development
of manufacturing process capabilities for dielectric ceramic materials for wireless
technology. Interest in entering the microwave ceramics market was also expressed
by workshop participants from several small companies.
Forms requesting anonymous feedback on the workshop were distributed to all participants
before the meeting adjourned. Attendees were overwhelming positive (98 %) in indicating
that the workshop was worth their time and that another should be held. Some specific
written comments from participants follow:
The workshop helped clarify what type of work should be done at national laboratories,
industry, and at universities. A future workshop should try to address the competitiveness
of the United States without compromising the competitive advantages of particular
U.S. companies.
NIST should act as a mediator to promote the sharing of information among U.S. industries.
This is the only way to compete with Japan.
NIST should provide measurement standards and methods for various chemical, physical,
and electronic properties of critical components and materials.
NIST should help industry assemble a microwave property measurement lab, produce a
how-to manual in this area (“Best Practices”), and arrange training courses/seminars
in this area of measurements.
NIST should publish a monograph on materials systems.
NIST can provide useful input to the high temperature superconductor (HTS) community
by evaluating the various techniques for measurement of HTS films and substrates and
proposing “guidelines” on how to evaluate them. NIST could provide “standard substrates”;
i.e., substrates that have been carefully measured at NIST, to the community to use
in normalizing QC (quality control) equipment. A need exists for a good technique
to measure the surface resistance of unpatterned HTS films for QC purposes.
The workshop included much discussion on ceramic materials and measurement directions;
future topics should include metallization issues.
NIST technical work should focus on generic chemistry and physics knowledge relevant
to wireless communication that will help industry achieve a more rapid “proprietary”
introduction of new microwave materials. Establishment of materials and test standards
is very important in this regard.