M-TEST: A test chip for MEMS material property measurement using electrostatically actuated test structures

Osterberg, P.M.; Senturia, S.D.

doi:10.1109/84.585788

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M-TEST: A test chip for MEMS material property measurement using electrostatically actuated test structures

Author(s): P.M. Osterberg , S.D. Senturia

Publication date (Print): June 1997

Journal: Journal of Microelectromechanical Systems

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

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Calculated elastic constants for stress problems associated with semiconductor devices

W A Brantley (1973)

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Dynamic micromechanics on silicon: Techniques and devices

K.E. Petersen (1978)

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Microfabricated structures for theinsitumeasurement of residual stress, Young’s modulus, and ultimate strain of thin films

Mark Allen, Mehran Mehregany, Roger T Howe … (1987)

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Journal

Title: Journal of Microelectromechanical Systems

Abbreviated Title: J. Microelectromech. Syst.

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

ISSN (Print): 10577157

Publication date (Print): June 1997

Volume: 6

Issue: 2

Pages: 107-118

Article

DOI: 10.1109/84.585788

SO-VID: c133cf55-76ac-4ab5-9c37-a086b64cff8a

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M-TEST: A test chip for MEMS material property measurement using electrostatically actuated test structures

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Emerald: Sustainable Structures & Infrastructures

Most cited references 10

Calculated elastic constants for stress problems associated with semiconductor devices

Dynamic micromechanics on silicon: Techniques and devices

Microfabricated structures for theinsitumeasurement of residual stress, Young’s modulus, and ultimate strain of thin films

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