ScienceOpen:
research and publishing network
For Publishers
Discovery
Metadata
Peer review
Hosting
Publishing
For Researchers
Join
Publish
Review
Collect
My ScienceOpen
Sign in
Register
Dashboard
Blog
About
Search
Advanced search
My ScienceOpen
Sign in
Register
Dashboard
Search
Search
Advanced search
For Publishers
Discovery
Metadata
Peer review
Hosting
Publishing
For Researchers
Join
Publish
Review
Collect
Blog
About
2
views
0
references
Top references
cited by
0
Cite as...
0 reviews
Review
0
comments
Comment
0
recommends
+1
Recommend
0
collections
Add to
0
shares
Share
Twitter
Sina Weibo
Facebook
Email
1,606
similar
All similar
Record
: found
Abstract
: not found
Article
: not found
Reliability prediction tools for SMD solder jointsWhalley, D.C. Soldering & Surface Mount Technol. Oct. 1991 (9) 8–9
Publication date
Created:
September 1992
Publication date
(Print):
September 1992
Journal:
International Journal of Fatigue
Publisher:
Elsevier BV
Read this article at
ScienceOpen
Publisher
Review
Review article
Invite someone to review
Bookmark
Cite as...
There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.
Related collections
Computational Tools for Drug Repurposing (REPO4EU)
Author and article information
Journal
Title:
International Journal of Fatigue
Abbreviated Title:
International Journal of Fatigue
Publisher:
Elsevier BV
ISSN (Print):
01421123
Publication date Created:
September 1992
Publication date (Print):
September 1992
Volume
: 14
Issue
: 5
Page
: 342
Article
DOI:
10.1016/0142-1123(92)90501-3
SO-VID:
c55d5410-2843-4a80-b41b-e749cfae7c6b
Copyright ©
© 1992
License:
https://www.elsevier.com/tdm/userlicense/1.0/
History
Data availability:
Comments
Comment on this article
Sign in to comment
scite_
Similar content
1,606
Energy Management by means of SMD Model Analysis for AMB Systems with Eccentricity
Authors:
R. Gouws
Transient analysis of latent damage formation in SMD capacitors by Transmission Line Pulsing (TLP)
Authors:
D. Helmut
,
G. Wachutka
,
G Groos
Fatigue failure in a model SMD jointChilton, A. C., Whitmore, M. A. and Hampshire, W. B.Solder. Surf. Mt. Technol. Oct. 1989 (3), 21–24
Authors:
See all similar