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      Thick amorphous complexion formation and extreme thermal stability in ternary nanocrystalline Cu-Zr-Hf alloys

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          Abstract

          Building on the recent discovery of tough nanocrystalline Cu-Zr alloys with amorphous intergranular films, this paper investigates ternary nanocrystalline Cu-Zr-Hf alloys with a focus on understanding how grain boundary composition affects the formation of disordered complexions. Binary Cu-Zr and Cu-Hf alloys with similar initial grain sizes were also fabricated for comparison. The thermal stability of the nanocrystalline alloys was evaluated by annealing at 950 {\deg}C, followed by detailed characterization of the grain and grain boundary structure. All of the ternary alloys exhibited exceptional thermal stability and remained nanocrystalline even after two weeks of annealing at this extremely high temperature. Even though some carbides do form and grow in these alloys during milling and annealing, the thermal stability is mainly attributed to the formation of thick amorphous intergranular films at high temperatures. Our results show that higher levels of dopant segregation and thicker boundary films exist in the ternary alloys, as compared to the binary alloys with similar dopant concentrations. While it is not required for amorphous complexion formation, this work shows that having at least three elements present at the interface can lead to thicker grain boundary films, which will maximize the previously reported toughening effect.

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          Stabilization of metallic supercooled liquid and bulk amorphous alloys

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            Ultrahigh strength and high electrical conductivity in copper.

            Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries.
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              A precipitation-hardened high-entropy alloy with outstanding tensile properties

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                Author and article information

                Journal
                01 August 2018
                Article
                1808.00507
                d8c66ed1-2944-4c27-96f3-7e246e405f34

                http://arxiv.org/licenses/nonexclusive-distrib/1.0/

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                Custom metadata
                13 figures
                cond-mat.mtrl-sci

                Condensed matter
                Condensed matter

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