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      Application of high‐rate E×B or magnetron sputtering in the metallization of semiconductor devices

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      Journal of Vacuum Science and Technology
      American Vacuum Society

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          Journal
          Journal of Vacuum Science and Technology
          Journal of Vacuum Science and Technology
          American Vacuum Society
          0022-5355
          January 1976
          January 1976
          : 13
          : 1
          : 157-164
          Article
          10.1116/1.568813
          d999b9bf-1042-46f9-8f24-6e2a32f18106
          © 1976
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