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      Plasma etching of HfO2 at elevated temperatures in chlorine-based chemistry

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          High-κ gate dielectrics: Current status and materials properties considerations

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            Ion flux composition in HBr/Cl[sub 2]/O[sub 2] and HBr/Cl[sub 2]/O[sub 2]/CF[sub 4] chemistries during silicon etching in industrial high-density plasmas

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              HfO2/SiO2 interface chemistry studied by synchrotron radiation x-ray photoelectron spectroscopy

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                Author and article information

                Journal
                Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
                Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
                American Vacuum Society
                0734-2101
                1520-8559
                January 2006
                January 2006
                : 24
                : 1
                : 30-40
                Article
                10.1116/1.2134707
                dc439410-327b-481f-bbda-328623fea132
                © 2006
                History

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