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      • Record: found
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      A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators

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          Field Assisted Glass‐Metal Sealing

          Daniel I. Pomerantz, George Wallis (1969)
          Article 0 comments Cited 121 times – based on 0 reviews     Review now
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            Fabrication of micromechanical devices from polysilicon films with smooth surfaces

            T.F. Kelly, H. Guckel, J.J. Sniegowski … (1989)
            Article 0 comments Cited 46 times – based on 0 reviews     Review now
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              Growth and Physical Properties of LPCVD Polycrystalline Silicon Films

              G. Harbeke (1984)
              Article 0 comments Cited 45 times – based on 0 reviews     Review now
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                Author and article information

                Journal
                Title: Journal of Microelectromechanical Systems
                Abbreviated Title: J. Microelectromech. Syst.
                Publisher: Institute of Electrical and Electronics Engineers (IEEE)
                ISSN (Print): 10577157
                Publication date (Print): Sept. 1996
                Volume: 5
                Issue: 3
                Pages: 166-179
                Article
                DOI: 10.1109/84.536623
                SO-VID: dddd020d-502c-493a-8e4b-df5a44c9b45d
                History
                Product
                Self URI (article page): http://ieeexplore.ieee.org/document/536623/

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