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      A review of dielectric polymer composites with high thermal conductivity

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          Enhanced thermal conductivity of polymer composites filled with hybrid filler

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            Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging

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              Thermal Expansion of Graphene Composites

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                Author and article information

                Journal
                IEEE Electrical Insulation Magazine
                IEEE Electr. Insul. Mag.
                Institute of Electrical and Electronics Engineers (IEEE)
                0883-7554
                July 2011
                2011
                : 27
                : 4
                : 8-16
                Article
                10.1109/MEI.2011.5954064
                e231c7e1-359e-4249-90ac-86d6d2aa4c2e
                © 2011
                History

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